IEEE Transactions on Electronics Packaging Manufacturing (T-EPM)
| Availability: | Free for staff and students of Leipzig University |
|---|---|
| Licensed Period: | Vol. 22, Iss. 1 (1999) - Vol. 33, Iss. 4 (2010) ReadMe |
| Licensed Period: | IEEE/IET Universitätskonsortium: Vol. 22, Iss. 1 (1994) - Vol. 33, Iss. 4 (2010) ReadMe |
| Homepage(s): | http://ieeexplore.ieee.org/servlet/opac?punumber=6104 |
| Fulltext available since: | Volume 22 , H. 1 (1999) |
| Fulltext available until: | Volume 33 , H. 4 (2010) |
| Publisher: | Institute of Electrical and Electronics Engineers (IEEE) ; IEEE Components, Packaging and Manufacturing Technology Society |
| ZDB-ID: | 2027513-4 |
| Subject(s): | Electrical Engineering, Measurement and Control Technology, Mechanical Engineering |
| E-ISSN(s): | 1558-0822 |
| P-ISSN(s): | 1521-334X, 1523-334X |
| Appearance: | Fulltext, online and print |
| Costs: | subject to fee |
| Comment: | Fehlerhafte ISSN der Vorlage: 1523-334X 1996-1998 u.d.T.: IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C (1083-4400) |
| List of participate institutions which offer full access. |