IEEE Transactions on Electronics Packaging Manufacturing (T-EPM)

Availability: Free for staff and students of Leipzig University
Licensed Period: Vol. 22, Iss. 1 (1999) - Vol. 33, Iss. 4 (2010)   ReadMe
Licensed Period: IEEE/IET Universitätskonsortium: Vol. 22, Iss. 1 (1994) - Vol. 33, Iss. 4 (2010)   ReadMe
Homepage(s): http://ieeexplore.ieee.org/servlet/opac?punumber=6104
Fulltext available since: Volume 22 , H. 1 (1999)
Fulltext available until: Volume 33 , H. 4 (2010)
Publisher: Institute of Electrical and Electronics Engineers (IEEE) ; IEEE Components, Packaging and Manufacturing Technology Society
ZDB-ID: 2027513-4
Subject(s): Electrical Engineering, Measurement and Control Technology, Mechanical Engineering
E-ISSN(s): 1558-0822
P-ISSN(s): 1521-334X, 1523-334X
Appearance: Fulltext, online and print
Costs: subject to fee
Comment: Fehlerhafte ISSN der Vorlage: 1523-334X 1996-1998 u.d.T.: IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C (1083-4400)
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